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| Manufacturer | Aries Electronics |
|---|---|
| Series | EJECT-A-DIP™ |
| Package | Bulk |
| Standard Package | 1 |
| Product Status | Active |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 32 (2 x 16) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) |
| Contact Material - Post | Brass |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature | -55°C ~ 105°C |
| Termination Post Length | 0.125" (3.18mm) |
| Material Flammability Rating | UL94 V-0 |
| Current Rating (Amps) | 3 A |
| Contact Resistance | - |
| Base Product Number | 32-C182 |
| RoHS Status | ROHS3 Compliant |
|---|---|
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8536.69.4040 |